1050D Automatic Deep Embossing Die Cutting Machine

12 heated temperature areas are in the die-cutting platform. They have a timing pneumatic temperature controller function, and each area can be controlled separately. It adopts hot embossing, hot bumps, hot indentation and so on. Hot press honeycomb is made by high strength heat-resistant material, it will be not transformation in high temperature. Hot press honeycomb knife and die cutting knife could be changed, so it achieves the switch of hot press function and die cutting function.

Thicken wall could stress-tolerant 1000 ton, the embossing is clearer, the effect is better.

The whole wall of this visiting and greeting card embossing machine is made of nodular cast iron, which is better than regular steel.

The 12 independent heating areas are controlled by a PID system, which was researched by our department. This system of paper cutting embossing machine could control the temperature stably, ensure the temperature is uniform in the whole heating system, quick response, it could adapt complex electrochemical aluminum transfer effect.

Delivery section add tester into security system. It is equipped with inset counter. Using subsection could adjust brush and sheet air-blowing device, so the finished product of delivery section could product stably. Gripper drive train expanded buffer device.

The design of stacker preparatory stage was improved, it could use prepared car sheet piling. Also could use ordinary hydraulic car sheet piling to stacker directly. The machine has four suction nozzles and four sending nozzles in feeder, ensure feed smoothly. Adopt import screw air-blowing device, the scrapbook embossing machine could make the sheet send smoothly.

The incline-type paper moving table top is more suitable to high-speed thin paper and location. Side location adopt dual purpose side device with pull guide and push guide, accounting to paper choose, it makes switching easier. It could switch front rise position arriving reduction of speed device, it is benefit of thin paper's location.